Agenda丨China Semiconductor Packaging and Test Techn

Cepem 微电子制造今天

_AGENDA_

Sept.8

Registration 08:30~22:30

Venue: Lobby，Platinum Hanjue Hotel, Wuxi

Sept.9

Summit Forum

Venue: Ballroom 398/399，Platinum Hanjue Hotel, Wuxi

Host	Guohua Zhang, Deputy Secretary-general of China Semiconductor Industry Association, Packaging Branch

08:30 - 09:40	Welcome Speech
	Dai Liu, Rotating Chairman of China Semiconductor Industry Association, Packaging Branch
	Addresses
	Keyun Bi, Honorary President of China Semiconductor Industry Association, Packaging Branch Yaguang Gao, Vice Mayor of Wuxi Municipal Government

	Shijiang Wang, Under-Secretary-General of China Semiconductor Industry Association Tianchun Ye, Team Leader of National Science and Technology Major Projects (02) Wenwu Ding, President of National IC Industry Development Fund Company Leader from CETC Yu Chi, Deputy Director of Industry and Information Technology office, Jiangsu Province Leader Ministry of Industry and Information Technology of the People's Republic of China, Electronic Information Division

09:40 - 10:00	Current Status and Outlook of China Packaging and Test Industry
	Dai Liu, Rotating Chairman of China Semiconductor Industry Association, Packaging Branch
10:00-10:20 Networking Break

10:20 - 10:40
	Juyan Xu, Academician of Chinese Academy of Engineering
10:40 - 11:00	Consideration for the Innovation and Development Strategy of China's IC Industry
	Tianchun Ye, Team Leader of National Science and Technology Major Projects (02)

11:00 - 11:20	IC Manufacturing: Review, Calibration, Consolidation
	Dr. Haijun Zhao, CEO of SMIC
11:20 - 11:40	Agile Design of High Energy Efficiency Chip
	Prof. Longxing Shi, Director of National ASIC System Engineering Research Centre

11:40 - 12:00	Consideration and Prospect of Packaging under the Background of New Technological Revolution
	Xuefei Ming, General Manger of Packaging Division of CKS IC company
12:00-13:00 Buffet Lunch

Host	Guoliang Yu, vice secretary-general of China Semiconductor Industry Association, Packaging Branch

13:00 - 13:20	Advanced SiP Trends & Application
	Weidong Liu, Technical Director, Hua Tian Technology CO., Ltd
13:20 - 13:40	Skyverse provides a comprehensive measurement solution for wafer-level package
	Yanzhong Ma, R&D Manager of Skyverse Limited

13:40 - 14:00	MANA'S Solution IN FOPLP RDL FORMATION
	Eric Cheng, Senior Technical Manager of Manz AG
14:00 - 14:20	New Development of Advanced Packaging Technology
	Xinfu Liang, VP of Jiangsu Changjiang Electronics Technology Co., Ltd.

14:20 - 14:40	NAURA Technology Solutions for 3D Integration in Advanced Packaging
	Dr. Xinyu Fu, Beijing NAURA Microelectronics Equipment Co., Ltd.
14:40 - 15:00	Package Solutions for High Performance & Low cost 5G IC
	Peng Wang, Technical Director of TongFu Microelectronics Co., Ltd.

15:00 - 15:20	Topics on ISO 26262 Functional Safety to IC Packaging and Testing
	Ted Wu, Director of VESP, Automotive Functional Safety Service Division
15:20-15:40 Networking Break

15:40 - 16:00	Advanced packaging trends and lithography solutions
	Yonghui Chen, Deputy General Manager of Shanghai Micro Electronics Equipment (Group) Co., Ltd.
16:00 - 16:20	High speed and high precision assembly machine for fan-out process
	Jiang Yongxin, President of Join Intelligent Equipment Technology Co.,Ltd

16:20 - 16:40	Inspection and Metrology full solution in advanced package
	Paisen Gu, General Manager of Camtek HK Ltd.Paisen Gu, General Manager of Camtek HK Ltd.
16:40 - 17:00	Novel Temporary And Permanent Bonding Materials For Advanced Packaging
	Dr. Dongshun Bai Business Development Director of Brewer Science

17:00 - 17:20	Developing Status and Opportunities of Thermosetting Polymeric Materials for Semiconductor Packaging
	Xiaoma Fei, Ph.D., Technical manager of Wuxi Chuangda Advanced Material Co., Ltd
17:20 - 17:40	The Application of Planar CT for Semiconductor
	Allen Shen, Application Director of Jetoptech

17:40 - 18:00
	Song Cui, Senior Manager of Infineon Technologies
18:30-20:30 Welcome Banquet

Sept.10

Symposium

Session I

Advanced Packaging & Test Technology and Process Equipment

Host	Dongmei Xu, vice secretary-general of China Semiconductor Industry Association, Packaging Branch

09:00 - 09:25	The Wet process Equipment Applied in IC Package
	Wei Jie, Director of R&D Center of Anhui Hongshi Automation Equipment Co., LTD
09:25 - 09:50	Semiconductor Testing Trend
	Steven Li, Regional Manager of Global Field Application Engineering, Teradyne Inc.

09:50 - 10:15	Turn-Key Solution for SiP
	Shao Yi, Deputy General Manager of Shinkawa(Shanghai)Co., Ltd.
10:15 - 10:40	Accuracy and Speed: from SMT to Semiconductor Packaging
	Jacky Dai, Marketing Manager–China, Universal Instruments Manufacturing (Shenzhen) Co., Ltd

10:40-10:55 Networking Break

10:55 - 11:20	Application of laser technology in advanced packaging field
	Chunhao Li, Ph.D, Director Engineer of Han’s DSI

11:20 - 11:45	Picosecond Laser wafer scriber
	He Liu, Chief Engineer of Chengdu Laipu Technology Co., Ltd
11:45 - 12:10	AFC100 flipchip bonder from Guangdong Ada Intelligent Equipment Ltd.
	Dr. Yunbo He, CEO of Guangdong Ada Intelligent Equipment Ltd.

12:10-13:30 Buffet Lunch

Host	Guoliang Yu, vice secretary-general of China Semiconductor Industry Association, Packaging Branch

13:30 - 13:55	Temporary bonding and de bonding：one of the key technologies for 3 D Packaging with SUSS solution
	Gong LI, General Manager of Suss MicroTec (shanghai) LTD
13:55 - 14:20	Nordson Solution in Advance Semiconductor Packaging
	Desmond Hor, Sales Director of Nordson March and Dage BondTest, Semiconductor Market Development Director

14:20 - 14:45	Advanced Packaging Technologies that enables innovation in data networking and mobile connectivity
	KM Kok, Die Attach Mainstream Asia, Vice President, Besi Singapore
14:45 - 15:10	SIPLACE application in Advanced Packaging
	Xu Ji, product Marketing Manager of Assembly Systems Ltd.

15:10-15:25 Networking Break

15:25 - 15:50	Deep-learning-based AOI sorting machine for high density etching frame
	Chi WANG, Founder/Board Chairman of SUZHOU ACCURACY ASSEMBLY AUTOMATION Co., Ltd

15:50 - 16:15	Nidec-Read 3DAOI+ADC
	Leo Liu, Optical Business Development Product & Business Development Devision、G.Manager, Suzhou Toubo Electronics Co. Ltd.（NIDEC-READ INSPECTION CANADA CORPORATION）
16:15 - 16:40	Integrated circuit testing and key technologies
	Zhang huibin, Vice chief engineer of CKS IC company

Sept.10

Symposium

Session Ⅱ

Advanced Packaging Technology and Key Materials

Host	Hongjun Zhuo, vice secretary-general of China Semiconductor Industry Association, Packaging Branch

09:00 - 09:25	Total solution of Epoxy molding compound and Die bonding paste with Hitachi Chemical Semiconductor Material
	Cheng Hua, Semiconductor Material Technology Dept. Section Manager, Hitachi Chemical (Suzhou) Co., Ltd.
09:25 - 09:50	Solder Ball Innovative Solution for Smart Auto Application Challenges
	Xianfeng Wang, Sales Director of Shanghai Phichem Material Co; Ltd.

09:50 - 10:15	Novel Water Soluble Fluxes Study for Heterogeneous Integration Assembly
	Aaron Yan, Area Technical Manager of Indium Corporation
10:15 - 10:40	Epoxy Molding Compound Technology Progress for Advanced Packaging
	Shanxue Wang, R&D Director of Beijing KEHUA New Materials Technology Co., Ltd

10:40-10:55 Networking Break

10:55 - 11:20	Peelable recycle frame of IC substrate and its technology
	He Zhong Liang, General Manager of ShenZhen Accelerated Printed Circuit Board Co.,Ltd.

11:20 - 11:45	Product information and development challenge of material for semiconductor package
	Yuki Ishikawa, Sanyu Rec Co., Ltd.
12:10-13:30 Buffet Lunch

Host	Guohua Zhang, Deputy Secretary-general of China Semiconductor Industry Association, Packaging Branch

13:30 - 13:55	Advanced ceramics contribute to the development of semiconductor industry---The process of Chinese ceramic capillary localization
	William chan, Material engineer of Chaozhou Three-Circle (Group) Co., Ltd. (CCTC)
13:55 - 14:20	Access embedded die for SIP solution
	Simon Chan, General Manager of ACCESS Semiconductor Co., China

14:20 - 14:45	Technology of Material for Power Device
	Zhengdong Ge, Information & Telecommunication Materials Research Laboratory China, Sumitomo Bakelite(Suzhou) Co.,Ltd.
14:45 - 15:10	Bonding Wire Technology Development and Semiconductor Industry Program in YEDA
	Song Qiang, Vice President of YANTAI YESDO ELECTRONIC MATERIALS CO., LTD

15:10-15:25 Networking Break

15:25 - 15:50	Hysol EMC for Power Packages
	Dr. Jacker Liu, Product Development Manager of Hysol Huawei Electronic Co., Ltd.

15:50 - 16:15	Anisotropy issues and grain orientation control of micro solder joints for fine pitch interconnection
	Zhao Ning, Professor of Dalian University of Technology
16:15 - 16:40	Co-design and production of high performance wafer level packaging
	Yong Ji, Deputy director MS MFG Department CKS

Sept.10

Symposium

Session III

AI, 5G with Advanced Packaging

Host	Yang Shen, vice secretary-general of China Semiconductor Industry Association, Packaging Branch

09:00 - 09:30
	Guicheng Lin, Hefei ImagEx Electronics Technology Co., Ltd.
09:30 - 10:00	Opportunities and challenges for Heterogeneous Integration
	Derek Zhang, Business Development Manager of ASM Pacific Technology Company Limited

10:00 - 10:30	Global Trends of IC Package Molding CAE Technology
	Chih Chung Hsu, Ph.D, RD Director of CoreTech System (Moldex3D) Co., Ltd
10:30-10:45 Networking Break

10:45 - 11:15	Innovative Applications Driving Advanced PKG
	Elbert Liu, Greater China Sales & Marketing of Amkor Technology
11:15 - 11:45	Technical exchange of intelligent factory management system in semiconductor industry
	Xiaomin Zhang, Intelligent Company Technical director, China Electronics System Engineering No.2 Construction CO; Ltd.

11:45 - 12:15	Situation and tendencies of Integrated Circuit test equipments
	Qianwen Wu, Vice chief engineer of CKS IC company
12:15-13:30 Buffet Lunch

Sept.10

Symposium

Session IV

Henkel Workshop

08:45-09:00 Registration
09:00-09:15 Welcome Remarks
09:15 - 09:35	Henkel Overall Advanced Packaging Solutions Introduction
	Jeremy You, APAC Business Development Manager

09:35 - 09:55	Henkel High Performance Technology on Flipchip
	Solomon Wu, Technical Service Manager
09:55 - 10:15	Henkel Total Solution on Wafer Level Package
	Rick Shen, Senior Technical Service Engineer

10:15-10:30 Tea Break

10:30 - 10:50	Henkel Overall Epoxy Solutions for Wirebond IC Applications
	Danhui Gu, Technical Service Engineer

10:50 - 11:10	Henkel High Performance Semi-sintering Technology on RF and Automotive Device
	Dr. Wei Yao, Scientific Associate
11:10 - 11:30	Henkel Film Solution on Wirebond IC and Stacking IC Memory Applications
	Leo Cheng, Principal Technical Service Engineer