国际第三代半导体论坛(IFWS)是引领全球第三代半导体新兴产业发展,促进相关产业、技术、人才、资金、政策合力发展的全球性、全产业链合作的高端平台。至今会议已成功举办三届,以第三代半导体在电力电子技术、新一代移动通信技术、固态紫外技术等应用的国际交流与合作为重点,带动创新合作和技术转移,为全球范围的技术与商业合作缔造价值。
2019年11月25-27日,第十六届中国国际半导体照明论坛(SSLCHINA 2019)暨2019国际第三代半导体论坛(IFWS 2019)将在深圳会展中心盛大召开。
本届论坛以“迎接新挑战 共创新时代”为主题,探讨大时代背景下半导体应用的无限遐想及实现路径。届时来自各方的专家将从前沿技术、跨界融合、资本整合、国际合作、产业趋势等角度带来最前沿的观点分享。
▍时间:2019年11月25-27日
▍地点:深圳会展中心
组织机构
主办单位:
国家半导体照明工程研发及产业联盟(CSA)
第三代半导体产业技术创新战略联盟(CASA)
承办单位:
深圳第三代半导体研究院
北京麦肯桥新材料生产力促进中心有限公司
支持单位:
国家科学技术部高新技术司
国家科学技术部国际合作司
国家工业和信息化部原材料工业司
国家节能中心
国家新材料产业发展专家咨询委员会
深圳市科技创新委员会
特别支持:
深圳市龙华区科技创新局
IFWS相关会议:
点击“会议主题”查看分会简介及日程↓↓
P201 衬底、外延及生长装备(SiC 和GaN)(5L菊花厅)点击查看
P202 功率电子器件及封装技术 (GaN和SiC)-1(6L茉莉厅)点击查看
P208 Micro-LED与新型显示(5L牡丹厅)点击查看
产业峰会 (免费会议)
P302:城市景观与夜游经济(点击查看)
P303:智能家居照明与跨界生态(点击查看)
P307:SiC功率半导体技术应用论坛暨新品发布会(点击查看)
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IFWS 2019日程总览
最终会议日程以现场为准
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开幕大会/Plenary: Opening Ceremony & Plenary Forum 主题:迎接新挑战 共创新时代/Rise to New Challenges, Rise for a New Era | |
时间:2019年11月25日下午14:00-18:00 地点:深圳会展中心 • 五层簕杜鹃厅 Time: November 25th, 2019 Afternoon 14:00-18:00 Location: Shenzhen Convention and Exhibition Center • 5th Floor Bougainvillea Hall | |
演示文件建议比例/Recommend Slides Size:16:9 | |
14:00- 14:05 | 开幕式-嘉宾介绍 / Opening Ceremony-Guests Introduction |
14:05- 14:20 | 开幕致辞 / Opening Address |
14:20- 14:30 | 全球半导体照明突出贡献奖颁奖典礼 The Award Ceremony of Global SSL Award of Outstanding Achievement |
14:30- 14:45 | 2019中国创新创业大赛国际第三代半导体专业赛国际及粤港澳大湾区赛区颁奖典礼 The Award Ceremony of IASIC 2019 • the International Division and the Greater Bay Area Division |
14:45- 15:00 | 广东省第三代半导体技术创新中心授牌暨签约仪式 Guangdong Wide Bandgap Semiconductors Technology Innovation Center Unveiling & Signing Ceremony |
论坛部分/Reports | |
15:00- 15:30 | 从硅基氮化镓LED进展看半导体照明未来 The Prospect of Solid State Lighting from the Recent Progress of GaN/Si based LED 江风益 中国科学院院士,南昌大学副校长、教授,国家硅基LED工程技术研究中心主任, JIANG Fengyi Academician of Chinese Academy of Sciences, Vice President & Professor of Nanchang University, Director of National Silicon-Based Semiconductor Lighting Engineering Technology Research Center |
15:30- 16:00 | 氮化镓功率电子的价值前景 The Value Proposition of Gallium Nitride Power Electronics Umesh K. MISHRA 美国国家工程院院士、加利福尼亚大学圣芭芭拉分校教授、Transphorm联合创始人&首席技术官 Umesh K. MISHRA Member of United States National Academy of Engineering; Distinguished Professor of University of California, Santa Barbara; CTO & Co-Founder of Transphorm |
16:00- 16:30 | 在可调光照明应用中研究记录人类行为:一项来自英国、面向未来的案例和实施 Tracking Human Behaviour in Real-World Installations of Spectrally Tuneable Lighting: A UK Case Study and Implications for Future Technology Anya HURLBERT 英国纽卡斯尔大学视觉神经科学教授、转化系统神经科学中心主任及学院院长 Anya HURLBERT Professor of Visual Neuroscience, Director of the Centre for Translational Systems Neuroscience and Dean of Advancement at Newcastle University |
16:30- 17:00 | 世界首次基于SiC籽晶生长的AlN单晶 Worldwide first true bulk AlN monocrystal grown on SiC seed Yuri MAKAROV Nitride Crystals Inc. 执行总裁 Yuri MAKAROV President of Nitride Crystals, Inc. |
17:00- 17:30 | 基于转换打印microLED和集成电路的显示技术 Emissive displays with transfer-printed microscale LEDs and ICs Christopher A. BOWER 美国X-Celeprint Limited首席技术官 Christopher A. BOWER Chief Technology Officer at X-Celeprint Limited, USA |
17:30- 18:00 | 中国第三代半导体的发展 The Progress of Wide Bandgap Semiconductors in China 第三代半导体产业技术创新战略联盟 China Advanced Semiconductor Industry Innovation Alliance (CASA) |
闭幕大会/Plenary: Closing Ceremony & Plenary Forum | |
时间:2019年11月27日下午13:30-16:30 地点:深圳会展中心 • 六层茉莉厅 Time: November 27th, 2019 Afternoon 13:30-16:30 Location: Shenzhen Convention and Exhibition Center • 6th Floor Jasmine Hall | |
演示文件建议尺寸比例/Recommend Slides Size:16:9 | |
13:30- 13:35 | 主持人开场/Host Opening Address |
13:35- 13:50 | 领导致辞/Welcome Address |
论坛部分/Reports | |
13:50- 14:20 | 针对microLED和自形成光子结构的纳米线应用 Nanowire-mediated realization of micro LEDs and self-formed photonic structures Lars SAMUELSON 瑞典皇家科学院院士、瑞典皇家工程科学院院士、瑞典隆德大学教授 Lars SAMUELSON Member of the Royal Swedish Academy of Sciences; Member of Royal Swedish Academy of Engineering Sciences; Professor of Lund University, Sweden |
14:20- 14:50 | 三安光电化合物半导体发展规划与进展 Compound Semiconductor Development Planning and Progress of Sanan Optoelectronics 林志东 三安光电股份有限公司副总经理,厦门市三安集成电路有限公司副总经理 LIN Zhidong Vice President of Sanan Optoelectronics Co. Ltd.,Deputy, General Manager of Xiamen Sanan Integrated Circuit Co., Ltd. |
14:50- 15:20 | 硅基氮化镓产业化发展的机遇与挑战 Opportunities and challenges of GaN-on-Si Mass Production 骆薇薇 英诺赛科科技有限公司董事长 LUO Weiwei Board Chair of Innoscience Technology Co., Ltd. |
15:20- 15:50 | 化合物半导体外延量产解决方案 Epitaxial Manufacturing Solutions for Compound Semiconductors Jens VOIGT 德国爱思强股份有限公司产品管理总监 Jens VOIGT Director of Product Management of AIXTRON SE, Germany |
15:50- 16:20 | 宽禁带功率半导体国际技术路线图 International Technology Roadmap for Wide Bandgap Power Semiconductors Braham FERREIRA 荷兰代尔夫特理工大学教授 Braham FERREIRA Professor at Delft University of Technology |
16:20- 16:30 | 闭幕总结 / Closing Summary |
P201:衬底、外延及生长装备 / The Technology in Substrate, Epitaxy and Wafer Growth Equipment | |
时间:2019年11月26日下午14:00-17:30 地点:深圳会展中心•五层菊花厅 Time: Nov 26th, 2019 Afternoon 14:00-17:30 Location: Shenzhen Convention and Exhibition Center • 5th Floor Chrysanthemum Hall | |
演示文件建议尺寸比例/Recommend Slides Size:16:9 | |
主持人 Moderator | 沈 波/ SHEN Bo 北京大学物理学院教授, 理学部副主任/Professor & Deputy Director, Division of Sciences, Peking University 徐现刚/XU Xiangang 山东大学教授,晶体材料国家重点实验室副主任/Professor & Deputy Director of State Key Laboratory of Crystal Material of Shandong University |
14:00- 14:25 | 同步辐射X射线衍射法实现氮化镓衬底及同质外延薄膜晶格面倾斜可视化 Synchrotron x-ray diffraction-based visualization of lattice-plane tilting of a GaN substrate and epitaxial film 坂田修身 日本国立材料研究所SPring-8 BL15XU线站站长,东京工业大学兼职教授 Osami SAKATA Station Director of the Synchrotron X-ray Station at SPring-8 and the Group Leaders of the Synchrotron X-ray group and the Synchrotron X-ray Characterization group, National Institute for Materials Science (NIMS); Adjunct Professor at the Tokyo Institute of Technology, Japan |
14:25- 14:45 | 基于MOVPE技术生长GaN表面的原位相干X射线研究 In situ coherent x-ray studies of surface dynamics during OMVPE of GaN 鞠光旭 美国亚利桑那州立大学助理教授 Guangxu JU Assistant Research Professor of Arizona State University, USA |
14:45- 15:05 | 碳化硅生长和衬底建模以及基于MOVPE技术的氮化镓生长模拟 Modeling of SiC crystal growth and epitaxy and simulation of GaN Metal Organic Vapor Deposition Andrey SMIRNOV 俄罗斯STR Group, Inc.资深研发工程师 Andrey SMIRNOV Senior Research Engineer of STR Group, Inc., Russia |
15:05- 15:20 | 蓝宝石基B0.375GaN/B0.45GaN量子阱结构的激光二极管中n-p电极对于p型电导率的影响 The effect of n-p electrodes upon the p-type conductivity of B0.375GaN/B0.45GaN QW/QB edge emitting laser diode grown over sapphire substrate Mussaab I. NIASS 郑州大学 Mussaab I. NIASS Zhengzhou University |
15:20- 15:40 | 工业4.0:对于电子工业和产品的大好时机 INDUSTRY4.0 as A Major Opportunity for Electronics Processes and Products Guido COLOMBO 意大利ORCHESTRA总裁 Guido COLOMBO President & CEO of ORCHESTRA, Italy |
15:40- 15:55 | 茶歇/Coffee Break |
15:55- 16:15 | 碳化硅装备和PVT晶体生长的关系 Interrelationship Between Equipment and PVT Crystal Growth in Silicon Carbide Larry B. ROWLAND 美国Aymont Technology Inc总裁 Larry B. ROWLAND CEO of Aymont Technology Inc., USA |
16:15- 16:35 | 基于碳化硅器件制造的先进化学浓度控制技术 Advanced Chemical Concentration Control for Fabrication of Devices Using SiC Ismail I. KASHKOUSH 美国NAURA-Akrion, Inc.首席技术官 Ismail I. KASHKOUSH Chief Technology Officer (CTO) of NAURA-Akrion, Inc., USA |
16:35- 16:55 | 单晶4H型碳化硅台阶生长机理 The step growth mechanism for 4H-SiC with Improved Single Polytypes 林伟 厦门大学副教授 LIN Wei Associate Professor of Xiamen University |
16:55- 17:15 | 基于深层瞬态光谱学的Al/Ti 4H-SiC肖特基结构缺陷研究 Investigation of Defect Levels of Al/Ti 4H-SiC Schottky Structures by Deep Level Transient Spectroscopy 何亚伟 中国科学院半导体研究所 HE Yawei Institute of Semiconductors, Chinese Academy of Sciences |
P202:功率电子器件及封装技术 / Technologies for Power Electronics and Packaging | |
时间:2019年11月26日全天09:00-17:40 地点:深圳会展中心•六层•茉莉厅 Time: Nov 26th, 2019 09:00-17:40 Location: Shenzhen Convention and Exhibition Center • 6th Floor Jasmine Hall | |
演示文件建议尺寸比例/Recommend Slides Size:16:9 | |
主持人 Moderator | 盛况/SHENG Kuang 浙江大学特聘教授,电气工程学院院长 / Distinguished Professor, Dean of the College of Electrical Engineering of Zhejiang University 陈敬/Kevin J. CHEN 香港科技大学教授 / Professor of the Hong Kong University of Science and Technology 陆国权/Guo-Quan LU 美国弗吉尼亚理工大学终身教授、天津大学材料科学与工程学院教授 / Tenured Professor of Virginia Polytechnic Institute and State University, Professor of Tianjin University |
09:00- 09:25 | 碳化硅功率器件最新进展综述 The latest development of SiC power devices 张清纯 北卡罗来纳州立大学客座教授, PowerAmerica研究院功率器件技术主任 Jon Zhang Visiting Professor of North Carolina State University, Power Device Technology Director in PowerAmerica |
09:25- 09:50 | 碳化硅高压电力电子器件及应用进展 New Progress of SiC high voltage power electronic devices and applications 杨霏 国家电网全球能源互联网研究院功率半导体研究所副总工、教授 YANG Fei Professor & Deputy Chief Engineer of Institute of Power Semiconductor at Global Energy Interconnection Research Institute, State Grid |
09:50- 10:10 | 改进碳化硅MOSFET RONSP的器件结构和工艺研究 SiC MOSFET Device Structure and Process Study 丁国华 苏州锴威特半导体股份有限公司总裁 DING Guohua CEO of Suzhou Convert Semiconductor Co. Ltd. |
10:10- 10:30 | 大电流1.2kV SiC JBS器件浪涌能力电热分析 Electro-thermal Analysis of 1.2kV-100A SiC JBS Diodes Under Current Overload 汤益丹 中国科学院微电子研究所 Yidan TANG Institute of Microelectronics of Chinese Academy of Sciences |
10:30- 10:50 | 用于气体检测和生物传感器的碳化硅基石墨烯材料 Graphene-on-SiC for gas detection and bio-sensors Alexander S. USIKOV 美国Nitride Crystals Inc. 首席技术官 Alexander S. USIKOV CTO of Nitride Crystals Inc.,USA |
10:50- 11:05 | 茶歇/Coffee Break |
11:05- 11:30 | 高电压宽禁带功率半导体封装技术 Packaging of high-voltage wide-bandgap power semiconductors Christina DIMARINO 美国弗吉尼亚理工大学助理教授 Christina DIMARINO Assistant Professor of Polytechnic Institute, Virginia State University, USA |
11:30- 11:50 | 高功率和高温IGBT及功率模块封装研究 High power & high temperature IGBT and WIDE bandgap power semiconductor modual package 朱文辉 中南大学微电子系创建主任、教授 ZHU Wenhui Professor of Central South University |
11:50- 12:10 | 宽禁带器件的设计和TCAD模拟 Design and TCAD Simulation of Widegap Semiconductor Devices 李湛明 加拿大CROSSLIGHT半导体软件公司创立人兼总裁 Simon LI Founder & CEO of Crosslight Software Inc., Canada |
12:10- 14:00 | 午休与POSTER交流 / Adjourn & POSTER Communication |
14:00- 14:25 | 击穿电压超过650V同时结温超过150°C的氮化镓功率器件 GaN Power Devices Beyond 650V and 150C Yifeng WU 美国Transphorm Inc.高级副总裁 Yifeng WU Senior VP of Engineering, Transphorm Inc., USA |
14:25- 14:50 | 基于半绝缘氮化镓衬底生长的高击穿电压氮化镓HEMT器件 High-breakdown voltage GaN HEMTs fabricated on semi-insulating GaN substrates Masaaki KUZUHARA 日本福井大学教授 Masaaki KUZUHARA Professor of University of Fukui, Japan |
14:50- 15:10 | 针对带有反向导通检测功能的E型氮化镓HEMT器件的栅极电源电路设计 A Gate Driver IC for E-mode GaN HEMTs with Reverse Conduction Detection 吴伟东 加拿大多伦多大学教授 Wai Tung NG Professor of University of Toronto, Canada |
15:10- 15:30 | 常关型AlGaN/GaN HFET功率器件的发展 Development of Normally-off AlGaN/GaN HFETs for Power Electronics 敖金平 日本德岛大学教授, 西安电子科技大学特聘教授 AO Jinping Professor of the University of Tokushima, Specially-Appointed Professor of Xidian University |
15:30- 15:45 | 通过高品质硅基氮化镓外延以实现无碳掺杂的高隔离性和高动态表现 High crystal quality GaN-on-Si to achieve excellent isolation and dynamic performance without carbon doping Atsushi NISHIKAWA 德国ALLOS Semiconductors首席技术官 Atsushi NISHIKAWA Chief Technology Officer of ALLOS Semiconductors, Germany |
15:45- 16:00 | 茶歇/Coffee Break |
16:00- 16:20 | 200mm/8英寸 GaN功率器件和基于GaN的电路技术:一个对于衬底供应商、制造商和代工工厂的全新机遇 200mm/8-inch GaN power device and GaN-IC technology: a new opportunity for wafer suppliers, foundries and IDMs Denis MARCON 比利时IMEC的高级业务发展经理 Denis MARCON Sr. Business Development Manager in IMEC, Belgium |
16:20- 16:40 | 200mm 40V-650V E型硅基氮化镓材料功率器件技术:从器件、封装、到系统 200mm 40V-650V E-mode GaN-on-Si Power Technology: from Device, Package, Reliability to System David C. ZHOU 英诺赛科研发中心副总裁 David C. ZHOU VP of R&D, Innoscience Technology Co., Ltd., |
16:40- 17:00 | 氮化镓:启动未来 GaN, Power the Future 傅玥 加拿大GaNPower International Inc. 副总裁兼联合创始人 Fred Yue FU Vice president and Co-founder of GaNPower International Inc., Canada |
17:00- 17:20 | 高铝组分的AlGaN/GaN异质结pH传感器 AlGaN/GaN heterostructure pH sensors with high Al composition in the barrier layer 周继禹 日本德岛大学 ZHOU Jiyu Tokushima University, Japan |
17:20- 17:40 | 下一代半导体器件外延制备前期的衬底清理技术 In-situ Wafer Cleaning for Pre-Epitaxial Deposition for Next Generation Semiconductor Devices Ismail I. KASHKOUSH 美国NAURA-Akrion, Inc.首席技术官 Ismail I. KASHKOUSH Chief Technology Officer (CTO) of NAURA-Akrion, Inc., USA |
P203:微波射频与5G移动通信 / RF Technology and 5G Mobile Communication | |
时间:2019年11月27日上午09:00-12:00 地点:深圳会展中心 • 五层玫瑰厅1 Time: Nov 27th, 2019 09:00-12:00 Location: Shenzhen Convention and Exhibition Center • 5th Floor Rose Hall 1 | |
演示文件建议尺寸比例/Recommend Slides Size:4:3 | |
主持人 Moderator | 蔡树军/CAI Shujun 河北半导体研究所副所长 / The Deputy Director of Hebei Semiconductor Research Institute 张乃千/ ZHANG Naiqian 苏州能讯高能半导体有限公司董事长/President of Dynax Semiconductor Inc. |
09:00- 09:25 | 适用于第五代行动通讯六吋氮化镓微波功放技術及基站功率电源模块 The Epi structure and Process Considerations of 6-inch GaN RF HEMT for 5G applications 邱显钦 台湾长庚大学教授 Hsien-Chin CHIU Professor of Chang Gung University |
09:25- 09:50 | 高频氮化镓HEMT器件和MMIC High frequeny GaN HEMTs and MMICs Peter BRÜCKNER 德国弗劳恩霍夫应用固体物理研究所部门技术部门经理 Peter BRÜCKNER Group Manager of Fraunhofer Institute of Applied Solid State Physics, Germany |
09:50- 10:15 | 5G 毫米波应用 5G mm Wave 刘建利 中兴无线技术总工及技术委员会专家 LIU Jianli Chief Engineer of Wireless Technology of ZTE, Expert of ZTE Technical Committee |
10:15- 10:35 | 高频硅基氮化镓晶体管 High-frequency GaN-on-Si transistors 刘志宏 西安电子科技大学教授 LIU Zhihong Professor of Xidian University |
10:35- 10:50 | 茶歇/Coffee Break |
10:50- 11:15 | 5G用毫米波Doherty功率放大器的研制 Development of a 5G Doherty Power Amplifier with A Millimeter Wave 张志国 北京国联万众半导体科技有限公司副总经理 ZHANG Zhiguo Deputy General Manager of Beijing advance semiconductor Co.,ltd |
11:15- 11:35 | 一种新型毫米波氮化镓高线性晶体管 High-linearity GaN HEMTs for millimeter-wave applications 张凯 南京电子器件研究所高级工程师 ZHANG Kai Senior Engineer of Nanjing Electronic Devices Institute |
11:35- 11:55 | 一种用于微波半导体芯片测试的高集成度多参数射频收发模块设计方法 A Highly Integrated Multi-Parameters RF Module for Microwave Semiconductor Testing 张光山 中国电子科技集团第41研究所 ZHANG Guangshan The 41st Research Institute of CETC |
11:55- 12:10 | 一种采用氮化镓MMIC和的分离FET器件的HMIC封装技术的便携X波段功率放大器 A Compact X-band Pallet Power Amplifier Using GaN MMIC and Discrete FETs with HMIC Technology 王毅 河北半导体研究所 WANG Yi Hebei Semiconductor Institute |
12:10- 14:00 | 午休与POSTER交流 / Adjourn & POSTER Communication |
P204:固态紫外器件技术/ Solid-State Ultraviolet Device Technology | |
时间:2019年11月27日 上午 09:00 -12:00 地点:深圳会展中心•六层水仙厅 Time: Nov 27th, 2019 Morning 09:00 -12:00 Location: Shenzhen Convention and Exhibition Center • 6th Floor Narcissus Hall | |
演示文件建议尺寸比例/Recommend Slides Size:16:9 | |
主持人 Moderator | 康俊勇 / KANG Junyong 厦门大学教授/Professor of Xiamen University 王军喜 / WANG Junxi 中科院半导体所研究员、半导体照明研发中心主任/ Professor and Director of R&D Center for Solid-State Lighting, Institute of Semiconductors, Chinese Academy of Sciences |
09:00- 09:25 | 采用石墨烯衬底和透明底部电极的AlGaN纳米线外延 UV LED AlGaN nanowire UV LED using graphene as substrate and transparent bottom electrode Helge WEMAN 挪威科学技术大学教授,挪威科学技术院院士 Helge WEMAN Professor at the Norwegian University of Science and Technology (NTNU), Norway; Academician of the Norwegian Academy of Technical Sciences (NTVA) |
09:25- 09:50 | 基于宽禁带半导体以及相关应用的UV检测仪器发展现状 Recent Development of UV Photodetectors based on Wide Bandgap Semiconductors and Their Applications 陆海 南京大学教授 LU Hai Professor of Nanjing University |
09:50- 10:15 | 新型深紫外LED封装发光技术提升 Improvement of Light extraction of Deep UV LED using Novel package 郭浩中 台湾交通大学特聘教授 Hao-Chung(Henry) KUO Distinguished Professor of National Chiao Tung University |
10:15- 10:35 | 基于中微Prismo HiT3TM MOCVD设备的深紫外LED结构优化 Optimization of AlGaN Based UVC LED Structure with AMEC Prismo HiT3 MOCVD Platform 胡建正 中微半导体设备(上海)股份有限公司主任工艺工程师 HU Jianzheng Principle Member of Technical Stuff of Advanced Micro-Fabrication Equipment Inc. China |
10:35- 10:50 | 茶歇/Tea Break |
10:50- 11:15 | 大批量工艺制备的高质量氮化铝模板材料表征分析 Characterization of high-quality AlN templates in industrial massive production 吴亮 上海大学教授,Ultratrend Technologies Inc总裁 WU Liang Professor of Shanghai University, CEO of Ultratrend Technologies Inc, |
11:15- 11:35 | 基于氮化物半导体和碳化硅光电子器件的仿真与分析 Numerical modelling and experimental demonstration for Nitride and SiC optoelectronic devices 张紫辉 河北工业大学教授 ZHANG Zihui Professor of Hebei University of Technology |
11:35- 11:45 | 直接在4英寸高温退火溅射AlN模板上生长的AlGaN基紫外LED AlGaN-based UV LED directly grown on 4-inch high-temperature annealed sputtered AlN template 倪茹雪 中国科学院半导体研究所 NI Ruxue Institute of Semiconductors, Chinese Academy of Sciences |
11:45- 11:55 | 采用n-AlxGa1-xN低波导层连续分级生长的深紫外纳米线激光二极管光学约束优化 Enhancement of Optical Confinement in Deep Ultraviolet Nanowire Laser Diode by Continuous-grading of n-AlxGa1-xN Lower Waveguide Layer. Muhammad Nawaz SHARIF 郑州大学 Muhammad Nawaz SHARIF Zhengzhou University |
11:55- 12:05 | 可原子尺度精确调控的AlN/GaN结构分选生长 Digital-alloyed AlN/GaN superlattices featuring with integral monolayer scale by hierarchical growth units 高娜 厦门大学 GAO Na Xiamen University |
12:05- 12:15 | 用于DUV和EUV探测的高性能SiC肖特基势垒光电二极管 High-Performance SiC Schottky barrier photodiode for DUV and EUV detection 王致远 南京大学 WANG Zhiyuan Nanjing University |
12:15- 14:00 | 午休/ Adjourn |
P208:Micro-LED与其他新型显示技术/ Micro-LED and other Novel Display | |
时间:2019年11月26日全天09:00 -17:40 地点:深圳会展中心•五层牡丹厅 Time: Nov 26th, 2019 09:00 -17:40 Location: Shenzhen Convention and Exhibition Center • 5th Floor Peony Hall | |
演示文件建议尺寸比例/Recommend Slides Size:16:9 | |
主持人 Moderator | 郭太良/GUO Tailiang 福州大学教授/Professor of Fuzhou University 严群/YAN Qun 福州大学教授/Professor of Fuzhou University 洪震 / Zhong Hong 中国光学光电子行业协会发光二极管显示应用分会秘书长 General Secretary of China Optics and Optoelectronics Manufactures Association LED Display Application Branch |
09:00- 09:25 | 对于制造CMOS电源、高性能MicroLED显示的新概念 A New Concept for Fabricating CMOS-driven, High-Performance MicroLED Displays Francois TEMPLIER 法国原子能委员会电子与信息技术实验室研究主任 Francois TEMPLIER Research Director of CEA-LETI, France |
09:25- 09:45 | 针对每平方厘米kW级别的高功率microLED三维热量传输研究 Study on three dimensional thermal transport in micro-LEDs at the level of kW/cm2 陈志忠 北京大学教授 CHEN Zhizhong Professor of Peking University |
09:45- 10:05 | 采用精准应力控制技术实现用于microLED显示的 '1 bin' 等级高波长均匀度(0.566 nm标准偏差)的8英寸硅基氮化镓LED 1 bin® wavelength uniformity on 200 mm GaN-on-Si LED for micro LED application with precise strain-engineering Atsushi NISHIKAWA 德国ALLOS Semiconductors首席技术官 Atsushi NISHIKAWA Chief Technology Officer of ALLOS Semiconductors, Germany |
10:05- 10:25 | 面向MicroLED显示的III-V族LED与超薄硅晶体管集成技术 Integration of III-V LEDs with Silicon Thin Film Transistors for Micro-LED Displays Vincent LEE 美国Lumiode, Inc.创立者兼总裁 Vincent LEE Founder & CEO of Lumiode, Inc., USA |
10:25- 10:40 | 茶歇/Coffee Break |
10:40- 11:00 | 北方华创Mini-LED和Micro-LED产品解决方案 NAURA product solutions for Mini-LED and Micro-LED 张宝辉 北京北方华创微电子装备有限公司刻蚀事业部LED产品线总监 ZHANG Baohui LED Product Line Director of ETCH BU, Beijing NAURA Microelectronics Equipment Co., Ltd. |
11:00- 11:20 | 驱动技术推动Micro LED 显示及照明应用 Driving Micro LED to future Lighting and Display 邰中和 和莲光电科技股份有限公司董事长 Kenneth TAI Board Chair of Jasper Display Corp. (JDC) |
11:20- 11:40 | 纳米模板生长和制备非/半极性面LED及Micro-LED器件 Growth and fabrication of semi/non-polar LEDs and Micro-LEDs using nano-patterning technology 刘斌 南京大学电子科学与工程学院副院长、教授 LIU Bin Professor & Deputy Dean of School of Electronic Science and Engineering, Nanjing University |
11:40- 12:00 | 针对MicroLED和OLED显示中亚像素评估的图像照明测量设备 Imaging Light Measurement Device for Subpixel evaluation of Micro-LED and OLED Displays Tobias STEINEL 德国Instrument Systems optische Messtechnik GmbH Tobias STEINEL Instrument Systems optische Messtechnik GmbH, Germany |
12:00- 14:00 | 午休与POSTER交流 / Adjourn & POSTER Communication |
14:00- 14:25 | 2018-2019年度中国LED显示应用行业发展报告 China LED Display Application Industry Development Report 2018-2019 洪震 中国光学光电子行业协会发光二极管显示应用分会秘书长 HONG Zhen General Secretary of China Optics and Optoelectronics Manufactures Association LED Display Application Branch |
14:25- 14:45 | MicroLED MOCVD工艺启动新一代显示技术 Enabling the Next Era of Display Technologies by Micro LED MOCVD Processing Arthur BECKERS 德国爱思强股份有限公司高级产品市场经理 Arthur BECKERS Senior Product Marketing Manager of AIXTRON SE, Germany |
14:45- 15:05 | 新一代显示用LED芯片技术研究与展望 Research Progress and Prospects of LED Chips for Next Generation Display Application 李鹏 华灿光电股份有限公司副总裁 LI Peng Vice President of HC SemiTek Corporation |
15:05- 15:25 | 低毒性量子点复合材料LED器件应用 Low toxic quantum dots polymer nanocomposites for LED applications 徐庶 河北工业大学教授 XU Shu Professor of Hebei University of Technology |
15:25- 15:45 | 电荷转移对量子点电致发光器件寿命的影响 Influence of the Charge Transfer on the Lifetime of Quantum-Dot Light-Emitting Diodes 刘国旭 易美芯光(北京)科技有限公司执行副总裁兼首席技术官 Jay Guoxu LIU Executive Vice President & CTO of ShineOn (Beijing) Technology |
15:45- 16:00 | 茶歇/Coffee Break |
16:00- 16:20 | Micro/Mini-LED:从背光到直视显示 Micro/Mini-LED: From Backlight to Direct-view Display 谢相伟 TCL工业研究院新型显示技术部项目总监 XIE Xiangwei Project Director of Novel Display Technology Department, TCL Industrial Research |
16:20- 16:40 | COB集成封装技术在超高清LED显示领域的应用 Application of COB Integrated Packaging Technology in UHD LED Display Field 屠孟龙 雷曼光电技术研究中心总监 TU Menglong Technology Research Center Technical Director of Ledman Optoelectronic Co., Ltd. |
16:40- 17:00 | LED显示之四合一技术路线前景 Prospect analysis of the 4-in-1 technical approach in LED Display Field 孔一平 山东晶泰星光电科技有限公司首席运营官 KONG Yi-Ping SHANDONG PROSPEOUS STAR OPTOELECTRONICS CO.,ltd., Chief Operating Officer |
17:00- 17:20 | Mini LED发展方向与集创解决方案 Mini LED, Future Directions and Solutions - from Chipone Technology 黄纹纲 北京集创北方科技股份有限公司产品经理 HUANG Wengang Chipone Technology (Beijing) Co, Ltd. Product Manager |
17:20- 17:40 | 携手发展的LCD与LED显示产业 Progress in Cooperation Between LCD and LED Industry 黄卫东 深圳市华星光电技术有限公司高工、博士 Huang Weidong Senior Engineer of TCL China Star Optoelectronics Technology |
P209:超宽禁带半导体技术/ Technologies for Ultra-Wide Bandgap Semiconductor | |
时间:2019年11月26日上午09:00 -12:00 地点:深圳会展中心•五层玫瑰厅2 Time: Nov 26th, 2019 Morning 09:00-12:00 Location: Shenzhen Convention and Exhibition Center • 5th Floor Rose Hall 2 | |
演示文件建议尺寸比例/Recommend Slides Size:4:3 | |
主持人 Moderator | 刘明/LIU Ming 中国科学院微电子研究所研究员,中国科学院院士/ Professor of Institute of Microelectronics of Chinese Academy of Sciences,Academician of Chinese Academy of Sciences 王宏兴/WANG Hongxing 西安交通大学教授/Professor of Xi'an Jiaotong University |
09:00- 09:25 | 超宽禁带氧化半导体的生长和特性 Growth and Characterization of Ultra-Wide Bandgap Oxide Semiconductors 郭其新 日本国立佐贺大学同步辐射光应用研究中心主任、电气电子系教授 Qixin GUO Director and Professor of Synchrotron Light Application Center, Saga University, Japan |
09:25- 09:50 | 氧化镓超宽禁带半导体器件 Gallium Oxide Ultra-Wide Bandgap Semiconductor Devices 龙世兵 中国科学院微电子所研究员,中国科学技术大学微电子学院执行院长 LONG Shibing Professor of institute of microelectronics, CAS; Executive Dean of microelectronics college, University of Science and Technology of China |
09:50- 10:15 | 金刚石超宽禁带半导体材料和器件新进展 Progress of diamond ultra-wide-band-gap semiconductor material and devices 张金风 西安电子科技大学教授 ZHANG Jinfeng Professor of Xidian University |
10:15- 10:30 | 茶歇/Coffee Break |
10:30- 10:55 | 多晶金刚石微纳米粉在碳化硅晶圆加工中的应用及其关键工艺技术 Application of Polycrystalline Diamond Micro-nano Powder in SiC Wafer Processing and Its Key Process Technology Christian JENTGENS 瑞士Microdiamant研发部门负责人 Christian JENTGENS Head of R&D department, Microdiamant, Switzerland |
10:55- 11:20 | 氮化铝/蓝宝石模板上六方氮化硼薄膜的有机金属气相外延研究 Epitaxial Growth of Hexagonal Boron Nitride Films on AlN/Sapphire Templates by MOVPE 刘玉怀 郑州大学教授, 日本名古屋大学客座教授 LIU Yuhuai Professor of Zhengzhou University, Visiting Professor of Nagoya University |
11:20- 11:45 | 六方氮化硼薄膜的磁控溅射制备及光电特性 Preparation and photoelectric properties of BN films by RF-sputtering 李强 西安交通大学副教授 LI Qiang Associate Professor of Xi’an Jiaotong University |
11:45- 12:00 | 高质量h-BN薄层和针对III族氮化物外延的缓冲层应用 High quality h-BN thin films and their application as flexible buffer layer for III-nitrides epitaxy 刘放 北京大学 LIU Fang Peking University |
P210: 可靠性与热管理技术/ Technologies for Reliability and Thermal Management | |
时间:2019年11月26日上午09:00 -12:00 地点:深圳会展中心•五层玫瑰厅1 Time: Nov 26th, 2019 Morning 09:00 -12:00 Location: Shenzhen Convention and Exhibition Center • 5th Floor Rose Hall 1 | |
演示文件建议尺寸比例/Recommend Slides Size:4:3 | |
主持人 Moderator | 刘胜/LIU Sheng 武汉大学教授、动力与机械学院院长、工业科学研究院执行院长/Professor & Dean of School of Power and Mechanical Engineering, Executive Dean of the Institute of Tenological Sciences, Wuhan University 李世玮/ Shi-Wei.Ricky LEE 香港科技大学先进微系统封装中心主任、香港科技大学深圳研究院常务副院长/ Professor and Director of Center for Advanced Microsystems Packaging (CAMP) of Hong Kong University of Science and Technology. |
09:00- 09:25 | 多热阻阵列LED模块的结温监视 Junction Temperature Monitoring of the Multi-LED Module in Service with the Thermal Resistance Matrix 李世玮 香港科技大学先进微系统封装中心主任、香港科技大学深圳研究院常务副院长 Shi-Wei.Ricky LEE Professor and Director of Center for Advanced Microsystems Packaging (CAMP) of Hong Kong University of Science and Technology. |
09:25- 09:50 | 采用表面声波微流控制技术操纵微粒子进入3D阵列模型 Manipulation of microparticles into 3D matrix patterns using standing surface acoustic waves (SAW) microfluidics DU Hejun 新加坡南洋理工大学副教授 DU Hejun Associate Professor of Nanyang Technological University, Singapore |
09:50- 10:15 | 量子点LED封装的内部热管理 Internal thermal management of quantum dot LED packaging 罗小兵 华中科技大学能源与动力工程学院院长,中欧清洁与可再生能源学院中方院长 LUO Xiaobing Professor & Dean of School of Energy and Power Engineering, China-Europe School for Clean and Renewable Energy, Huazhong University of Science and Technology |
10:15- 10:40 | 高压LED及其可靠性研究 High voltage light emitting diode and its reliability 郭伟玲 北京工业大学教授 GUO Weiling Professor of Beijing University of Technology |
10:40- 10:55 | 茶歇/Coffee Break |
10:55- 11:20 | 加速测试条件下高品质低成本的LED电源寿命对比性研究 A Comparative Study of the Life-Times of High-End and Low-Cost Off-Line LED Drivers Under Accelerated Test Conditions Ferdinand KEIL 德国达姆施塔特工业大学研究助理 Ferdinand KEIL Research Assistant of Technische Universität Darmstadt, Germany |
11:20- 11:40 | 适用于可见光通信高带宽微发光二极管的可靠性分析 Reliability of High Bandwidth Micro-LEDs for Visible Light Communication 马占红 中国科学院半导体研究所 MA Zhanhong Institute of Semiconductors, Chinese Academy of Science |
11:40- 12:00 | 汽车前照灯用LED阵列模组的光、热设计 Optical-Thermal Design of LED Matrix Module for Automotive Headlamps 陈威 半导体照明联合创新国家重点实验室(常州基地)研发工程师 CHEN Wei Research Engineer of Changzhou Institute of Technology Research for Solid State Lighting |
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