ICEPT 2021技术专题论坛议程【第22届电子封装技术国际会议】

  以下是技术专题论坛议程安排：

Thursday, September 16th, 9:00-12:30 AM

Thursday, September 16th, 13:30-17:00 PM

Friday, September 17th, 9:00-12:30 AM

Billy Tang is working for Thermo Fisher Scientific as EFA sales development manager. He graduated from Shanghai University in 2003 and majored in material physics mostly related to semiconductor. Before joining Thermo Fisher Scientific, he had worked in HHNEC & HLMC more than 13 years. In those years, Billy focused in failure analysis both in EFA & PFA for multifarious products included logic, memory, analog, driver IC, power MOSFET, CIS and others. He led PFA and EFA team to support customers for design debug, yield enhancement & customer returning. 

Billy is familiar with most FA technologies from EFA to PFA, after joining Thermo Fisher Scientific, he focuses more on the theory and design of those failure analysis techniques on system. Based on his better understanding combining with the experience in application, Billy could provide various solution from EFA to PFA workflow to customers in different segments such as fabless, foundry, packaging house, FPD and others. Fault isolation is major technology offered to customers, and lock-in thermography mainly focuses on packaging level and board level defect localization non-destructively. Billy has rich experience in the solution which could be shared to packaging customer especially in advanced packaging.

Dr. Haibo Fan, working as Senior Principal Engineer in Packaging R&D-Advanced Material Technology and Modeling, Nexperia Hong Kong. He got PhD degree from Hong Kong University of Science and Technology (HKUST) in 2005, then worked in HKUST, Philips LED lighting global R&D Center, NXP Hong Kong and Nexperia Hong Kong with 20+ year experience on simulation, and 10+ year industry experience on design and reliability. He authored or co-authored more than 50 peer-reviewed technique publications, published 2 books and 3 book chapters.

Dr. Ning-Cheng Lee is the Vice President of Technology of Indium Corporation. He has been with Indium since 1986. Prior to joining Indium, he was with Morton Chemical and SCM. He has more than 30 years of experience in the development of fluxes and solder materials for SMT industries. He received his PhD in polymer science from University of Akron in 1981, and BS in chemistry from National Taiwan University in 1973.

Ning-Cheng is the author of “Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP, and Flip Chip Technologies” by Newnes, and co-author of 5 other books. He received 1991 award from SMT Magazine and 1993 and 2001 awards for best proceedings papers of SMI or SMTA International Conferences, 2003 Lead Free Co-Operation Award from Soldertec, 2008 and 2014 awards from IPC for Honorable Mention Paper – USA Award of APEX conference, and 2010 Best Paper Award of SMTA China South Conference.  He was honored as 2002 Member of Distinction from SMTA, 2006 Exceptional Technical Achievement Award from CPMT, 2007 Distinguished Lecturer from CPMT, 2009 Distinguished Author from SMTA, 2010 Electronics Manufacturing Technology Award from CPMT, 2015 Founder’s Award from SMTA, and 2017 IEEE Fellow.

Prof. Yunhui Mei (S’21 of IEEE) received the B.S. and Ph.D. degrees from Tianjin University, Tianjin, China, in 2006 and 2010, respectively. He was studied at the Center for Power Electronics Systems, Virginia Tech. He is currently a professor of School of Electrical and Electronic Engineering (ECE), Tiangong University. His current research interests include power packaging and reliability. He had published more than 133 papers, 1 book, 1 book chapter (Springer), and 23 granted patents. He had won 2016 IEEE CPMT Japan Chapter Young Award, 2017 IEEE ICEP-IAAC Outstanding Technical Paper Award, 2017 APEC Best Presentation. He was granted as Outstanding Youth of Natural Science Foundation of China in 2019. He also won The first class Technical Innovation Award of CHINA POWER SUPPLY SOCIETY and CHINA ELECTROTECHNICAL SOCIETY in 2019 and 2020, respectively. He is vice director of power devices committee of CHINA POWER SUPPLY SOCIETY.

Prof. Chih Chen received his Ph.D. degrees in Materials Science of University of California at Los Angeles (UCLA) in 1999 in Prof. King-Ning Tu’s group. He served as lecturer at UCLA MSE from 1999-2000. He joined National Chiao Tung University (NCTU), Taiwan as an assistant professor in 2000. He is currently the chairman & distinguished professor of Department of Materials Science and Engineering in NCTU, Taiwan. Professor Chen discovered electrodeposition of (111)-oriented nanotwinned Cu, and reported it in Science 336, 1007-1010 (2012), and transferred the fabrication technology to Chemleaders, Inc, Taiwan for mass production in 2016. Therefore, he received the 2016 National Innovation Award, 2016 Materials Innovation Award, Materials Research Society, Taiwan, 2017 Outstanding Technology Transfer Award on Electroplating and Application of High (111)-oriented Nanotwinned Cu, 2018 Outstanding Researcher Award, Ministry of Science & Technology, Taiwan. TMS 2018 Research to Practice Award, The Minerals, Metals & Materials Society (TMS), USA. It is noteworthy to mention that TMS is the second largest materials society in the world and there are over 4000 members in TMS. There is only one recipient each year for the Research to Practice Award. He was recognized as fellow of International Association ofAdvanced Materials (IAAM) in 2020.

His current research interests are reliabilities of flip-chip solder joints and microbumps for microelectronics packaging, including electromigration, thermomigration of solder joints. He focuses on fabrication and applications of nanotwinned Cu in recent years, such as low-temperature Cu-to-Cu direct bonding, high strength nanotwinned Cu lines and films for 3D IC integration. He published 170 journal papers and he holds 30+ Taiwan and US patents. He is currently writing a book for Wiley on Electronic Packaging Science and Technology, and the book will be in production in 2021.

Prof. Binbin Jiao, Head of Reasarch Group, Institute of Microelectronics Chinese Academy of Sciences. His group's expertise covers MEMS devices, Microsystems, CMOS-MEMS process development, and Microchannel cooling for chips. He has participated in a number of National projects as National High Technology research and Development Program of China, Chinese Equipment Pre-Research Field Foundation Key Project, and obtained a number of financial supports including Hislicon, Miramems, Dali Technology. Recent award, Chihming Ho Best paper finalist, The 16th IEEE-NEMS 2021.

Dr. Hongwen He, was born in Langfang city, Hebei province, graduated with a PH.D. degree from the School of Materials Science and Engineering, Beijing University of Technology, and a postdoc from the Department of Mechanical Engineering, Tsinghua University in 2012. Currently，he is serving as the Chief Technology Officer (CTO) of Payton Technology (Shenzhen) Co., Ltd., responsible for advanced packaging technology research and development. He once worked at the Institute of Microelectronics of the Chinese Academy of Sciences/NCAP、HISILICON. He has more than ten years of advanced packaging technology research and management experience. He once led and participated many national projects, such as National Science and Technology Major Project of China, national natural fund projects, post-doctoral fund projects, etc. More than 40 academic papers have been published in core journals, and more than 20 invention patents have been authorized.

Dr Jifang Tao received his PhD degree from Beijing University of Posts and Telecommunications in 2012. Currently, he is a Professor at School of Information Science and Engineering, Shandong University. He worked in Nanyang Technological University (2010-2013), Goertek Inc (2013-2014), Institute of Microelectronics A*STAR (2014-2018). He is the author or co-author of over 50 publications including peer-reviewed journal papers. His research interests include advanced sensor and fabrication process based on silicon photonics technology and MEMS technology.

Dr. Hiroshi Nishikawa has received his MS degree in 1999 and Ph.D. degree in 2002 from Osaka University, Japan. From 2005 he has been working at Joining and Welding Research Institute of Osaka University and now is Professor. His research interest includes micro-joining processand interconnection for electronicspackaging with high-reliability and high-performance, especially soldering using lead-free solders, sintering using nanomaterials, transient liquid phase bonding and electrically conductive adhesive bonding. He has published more than 150 academic papers.

Dr. Jing Zhang is the director of innovation China of Heraeus Electronics. Dr. Zhang graduated from Delft University of Technology, where he majored in high-power electronic packaging process and reliability. In 2017, he joined Heraeus, focusing his research on advanced packaging and reliability evaluation for the WBG semiconductor devices. Dr. Zhang has led or participated in more than 30 domestic and international R&D projects worth more than 90 million yuan. He has also undertaken projects worth 35 million yuan as the first responsible person. Results of these projects have been already adopted in many industries including new energy vehicles, high-speed rail and semiconductor lighting. He has participated in the EU project “New Test Methods and Standards for Semiconductor Lighting (MESaIL)”, which has become a key basis of the EU LED lamp testing standard DIN EN 13032-4. He has published 8 papers, 4 of which are completed as the first author; authored 1 academic work; presented 7 reports at international academic conferences, including 1 report at the ESTC conference. Dr. Zhang is the first Founding Chairman of IEEE Electronics Packaging Society (EPS) Benelux Branch, the Executive Secretary of the International Technology Roadmap for Wide Bandgap Power Semiconductors (ITRW), and a member of the Packaging Branch. He also serves as a member of the Technical Committee of the Center for Shanghai Silicon Carbide POWER Devices Engineering & Technology Research, a member of the Youth Committee of the China Advanced Semiconductor Industry Innovation Alliance, a member of the Packaging Branch of the China Third Generation Semiconductor Roadmap Committee, and a member of the Nanotechnology Sintered Material Standardization Committee. Dr. Zhang once participated in the EU research project ESiP, which has been granted the ENIAC Innovation Award.

Mr. Shen holds B.S. degree in Mechanical design and manufacturing from He Nan University of Science and Technology. He has more than 24 years of working experience in the semiconductor industry since 1996.

He has been working on end-to-end development, technology transfer, NPI & high volume production in FBGA, QFN, QFP, MEMS and Memory packaging in STATS ChipPAC. Currently, he is a leader for JCET Group WB group R&D center and engineering group team, and focusing on core customer technology support in WB advanced assembly technology and product development. He holds over 3 US patent in the field of advanced packaging.

Prof. Xudong Zou received the B.Sc. degree in Microelectronics from Peking University, China, in 2009, and the Ph.D. degree in Microsystem from the University of Cambridge, U.K., in 2013. He was affiliated with the Nanoscience Center, Department of Engineering, University of Cambridge, as a Research Associate, and the Churchill College as a Post-Doctoral By-Fellow. He joined Institute of Electronics, Chinese Academy of Sciences in 2016 and is currently a Principal Investigator with the State Key Laboratory of Transducer Technology, Aerospace Information Research Institute, Chinese Academy of Sciences and a Professor in the School of Electronic, Electrical and Communication, University of Chinese Academy of Sciences. His main research interest lies in the area of MEMS, with a focus on micromachined resonators in inertial sensor, magnetic sensor and signal process applications. He also works on the sensor fusion technologies for autonomous navigation and distributed PNT applications. He has published over 50 peer-reviewed papers in the area of MEMS, Robotic and Artificial Intelligence and granted 6 patents as co-inventor.

Dr. Sun is currently the Vice President at National Center for Advanced Packaging (NCAP China), responsible for the research & development as well as NPI group. Since 2012, Peng has worked for NCAP and held various technical and managerial positions in the field of advanced packaging development. Prior to NCAP, Peng was a staff engineer of Flip Chip Central Engineering for STATS ChipPAC. He began his career with ASTRI HK as reliability engineer of advanced packaging. Dr. Sun received a bachelor’s degree in physical chemical from university of science & technology Beijing in 2001. He received his PhD in micro-technology and nano-science from Chalmers University of technology in 2007. He has over 60 patents on packaging structure and process, also has published over 20 conference/journal papers.

Prof. Xing-Chang Wei received the Ph.D. degree in electrical engineering from Xidian University, Xi’an, China, in 2001. From 2001 to 2010, he was with the A-STAR Institute of High-Performance Computing, Singapore, as a Research Fellow, Senior Research Engineer, and Research Scientist. In 2010, he joined Zhejiang University, China, as a Full Professor. He has authored one book, co-authored one book chapter, and more than 130 papers published in IEEE Transactions and international conferences. His main research interests include electromagnetic interference modeling and testing, power and signal integrities design. He is the recipient of the Singapore Institution of Engineers Prestigious Engineering Achievement Award in 2007, for his contribution to the development of the reverberation chamber for the electromagnetic radiation measurement, New Century Excellent Talents Award from China Ministry of Education, and numerous paper awards from IEEE international conferences, including APEMC, EMC Compo, SPI, EuCAP, IWS, and ICEPT. He was TPC Co-Chair of 2010 IEEE EDAPS, Technical Paper Co-Chair of 2018 IEEE APEMC Symposium, Program Chair and Finance Chair of 2012 and 2016 APEMC, respectively, and TPC members of electromagnetic compatibility related international conferences.

Prof. Rong Sun received her Ph.D degree in physical chemistry at Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences. She is now a professor and director of the institute of Advanced Materials Science and Engineering, Shenzhen Institute of Advanced Technology (SIAT), Chinese Academy of Sciences. She is also the director of the Center for Advanced Electronic Materials at SIAT, and dean of the Shenzhen Institute of Advanced Electronic Materials (SIEM) at SIAT. Dr. Rong Sun has been focusing on the research of design and complete process of materials for advanced electronic packaging, with efforts on both basic research and industrialization. Recently, Dr. Rong Sun has led a number of national, provincial, and ministerial scientific research projects, including the National Key R&D Program of China, National major projects on electronic packaging materials, NSFC, and projects from Guangdong, Shenzhen and Enterprises. She holds over 190 patents, published over 500 papers, and co-authored one book.

Dr. Bin Zhou is the deputy chief engineer of the national key laboratory, CEPREI. Dr. Bin ZHOU received his phD degree on electronic and information engineering at South China University of Technology, Guangzhou, China. He jointed the 5th electronic research institute of the MIIT(CEPREI) in 2007. He led the team to carry out the advanced packaging reliability and thermal management research. His research achievements in solder joint reliability and thermal analysis of electronic devices has been adopted in many industry application. He was named an outstanding scientific and technological worker of the Chinese Institute of Electronics in 2021. So far, he presided over 20 provincial and ministerial-level projects (including key projects), participated in 4 national major special projects, won 2 innovation team awards, and 4 provincial and ministerial level scientific and technological progress awards. He published 47 papers and holded 9 patents. He is a review expert of several academic organizations and special reviewer of 3 journals.

Prof. Yun Chen received the B.S. (09) and Ph.D.(14) degrees in mechanical engineering from Central South University, Changsha, China. He was a Visiting Scholar with the Georgia Institute of Technology (2016-2017) and working as a Hong Kong Scholar Postdoctoral Fellow with The Chinese University of Hong Kong (2017-2019). He currently severs as the associate dean with the School of Electromechanical Engineering and the professor with State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology. He has authored more than 40 peer-reviewed journal papers (H index:14) and holds over 70 patents including 7 US patents. He won the first prize of Outstanding Scientific Research Achievement Award (Science and Technology) of Higher Education Institutions (2015), the first prize of Science and Technology Progress Award of Guangdong Province (2018), the second prize of Science and Technology Progress Award of the Machinery Industry Federation (2018), Excellent Doctoral Thesis Award of Hunan Province (2017), and the Best Poster Award of Hong Kong Scholars Annual Conference (2019). His research interests include semiconductor processing technology, microelectronics packaging technology and equipment development.

Mr. Zhaozheng HOU is the Director of Technology & Strategy Department in Digital Energy Sector and the member of the Digital Energy Technology Committee of Huawei. He joined Huawei in 2007 and is responsible for Huawei's digital energy technology & strategy. He setup the Digital Energy Power Packaging Team for Huawei, targeting to identify the leading process roadmap for the power packaging industry. With his pioneering work in multiple fields, he applied more than 60 patent applications in US/CN.

Dr. Zhiwen Chen received his bachelor degree at Huazhong University of Science and Technology, then earned his PhD degree at the Wolfson School of Mechanical and Manufacturing Engineering at Loughborough University, UK. In 2018, he joined the Institute of Technological Science at Wuhan University as an associate professor. Dr. Chen has published more than 30 research papers and filed more than 10 patents. He also won a National Defense Science and Technology Progress Award. His research interest is focused on mechanics of materials and modeling inelectronic packaging.

Prof. Huaiyu Ye, has received BS degree in Shanghai Jiao Tong University, China, MA degree and Ph.D. degree in Delft University of Technology, the Netherlands (TUDelft). Currently, he is Senior Researcher and Associate Professor in Southern University of Science and Technology (SUSTech), the Head of advanced packaging of power electronics in Shenzhen Institute of Wide-Band Gap Semiconductors(WinS), and Guest Professor of TUDelft. He has worked in Materials innovation institute (M2i) and Netherlands Organisation for Applied Scientific Research (TNO) in Europe and in Chongqing University. He is the committee member of the IEEE International Technology Roadmap for Wide Bandgap Power Semiconductors (ITRW), Power Electronics Committee of the Chinese Electrical Engineering Society, and ICEPT, CSEE, EuroSimE, China SSL & IFWS.

His research interest includes advanced packaging, wide-bandgap semiconductor packaging technology, novel semiconductor materials and devices, novel packaging materials, nano-metal synthesis and sintering mechanism, advanced packaging testing and reliability, and etc. He has chaired and participated more than 20 projects in China and Europe, including National Key R&D Program of China, the Key-Area Research and Development Program of GuangDong Province, National Natural Science Foundation of China, Europe ENIAC Project, etc. He has been awarded Talents Programs by Chongqing, Shenzhen, and China Advanced Semiconductor Industry Innovation Alliance. He is fully responsible for the construction and operation of the power electronics packaging pilot line in WinS. So far, he has applied for more than 160 patents, issued 36 patents, 13 PCTs, published 56 SCI papers and one research monograph by Wiely.

Dr. Wenbo Zhu received his   Ph.D degree in electronics packaging from Huazhong University of Science and   Technology and Loughborough University in 2016, and joined the Flexible   Printed Electronics Technology Center of Harbin Institute of Technology   (Shenzhen) in 2020. His current research mainly focuses on the advanced   packaging materials and heterogeneous integration for power devices (SiC/GaN)   and flexible electronics, including nano-silver/copper paste, nano-ink and   metal-nanowire aerogels, and the correlatedsimulation, structure design,   manufacturing process, and thermal-mechanical reliability. He has authored or   co-authored about 10 journal papers and 15 conference papers and applied for   more than 20 patents on electronics packaging.

Dr. Zhuo Li is an Associate Professor in the Department of Materials Science at Fudan University. Her research interests include functional polymer composites for electronic packaging and stretchable electronics. She received her B.S. from Tongji University, her M.S. from Virginia Tech and her Ph.D. degree from Georgia Institute of Technology. Before joining Fudan, she worked as a Materials Engineer at Celanese Corp. and CNPC USA, respectively. She was a recipient of the Shanghai Pujiang Program (2017), One Thousand Talents Plan Youth Program (2018), Rising Star Program (2020) from Shanghai City, and IEEE EPS Outstanding Young Engineer Award (2020). She published more than 50 papers in journals such as Nat. Commun., Adv. Funct. Mater., and received more than 2000 citations. Dr. Li serves as the technical committee for IEEE ECTC and IEEE ICEPT, as well as the co-president for IEEE-EPS Shanghai Chapter.

Ms. Wenying Wu has received her Bachelor's degree in Environmental Engineering from University of Science and Technology Beijing, Master's degree in Economics from University of International Business and Economics Beijing. In the early career, she was engaged in the business related to metal raw materials, then she joined NAURA and has been working for the semiconductor equipment industry.